Thick Flim Metalized Beryllium Oxide Ceramic Substrates
High Ruggedness: Robust construction minimizes the possibility of outgassing.
Nickel Plating: Ensures durability without blistering.
Versatility: Suitable for various applications requiring high thermal and electrical performance.
Applications: Wire Bonding Platforms, Microwave PCBs, Thermoelectric Coolers (TEC) for Lasers, Hybrid Integrated Circuits (HIC) for Automotive, High-Power Semiconductor Modules, Hermetic Electrical Packaging, etc.